Manufacturing Engineering Technology - Microelectronic Manufacturing, Bachelor of Applied Science
Curriculum Code #9601
Effective May 2026
Division of Engineering, Business and Information Technologies
The Manufacturing Engineering Technology - Microelectronic Manufacturing program prepares individuals to apply engineering principles and technical skills to design, assembly, prototyping, and manufacturing of printed circuit boards (PCB) used in electronic hardware production. Includes hands-on machine operation of equipment used in high volume electronic assembly, use of software for designing PCB layout and bills of materials, programming and operation of automated PCB manufacturing equipment with surface mount technology, quality control principles including lean and six sigma, in-circuit test fixture design, test engineering, and engineering analysis of the physical design and electronic function of electronic hardware containing digital microcontrollers, analog circuitry, and MEMS sensors.
| First Year | ||
|---|---|---|
| Fall Semester | Hours | |
| ELCT 111 | ELECTRICAL CIRCUITS I 1 | 3 |
| ELCT 115 | FABRICATION PROCESS FOR ELECTRONICS | 2 |
| MTHM 155 | TECHNICAL MATHEMATICS I 1 | 4 |
| MEMS 122 | INTRODUCTION TO MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) | 4 |
| MEMS 124 | PRINTED CIRCUIT BOARD TEST & TROUBLESHOOTING 3 | 3 |
| SDEV 101 | INTRODUCTION TO THE LCCC COMMUNITY 2 | 1 |
| Hours | 17 | |
| Spring Semester | ||
| CADD 111 | INTRODUCTION TO COMPUTER AIDED DRAFTING 3 | 2 |
| CADD 216 | INTRODUCTION TO 3D MODELING AND PRINTING | 1 |
| DFAB 111 | INTRODUCTION TO PERSONAL FABRICATION | 1 |
| ENGL 161 | COLLEGE COMPOSITION I 1 | 3 |
| MEMS 132 or MEMS 133 | MEMS PACKAGING 3, 8 or INTRODUCTION TO CIRCUIT BOARD DESIGN | 3 |
| MEMS 134 | THRU-HOLE MANUFACTURING 3 | 2 |
| MEMS 136 or ELCT 121 | INTRODUCTION TO SEMICONDUCTORS AND CLEANROOM PROCESSING 3, 8 or DIGITAL ELECTRONICS | 4 |
| Hours | 16 | |
| Second Year | ||
| Fall Semester | ||
| CHMY 171 | GENERAL CHEMISTRY I 1 | 5 |
| ELCT 233 | ELECTRONIC DEVICES I 3 | 4 |
| MEMS 211 | SEMICONDUCTOR PROCESSING 3 | 3 |
| MEMS 287 | WORK-BASED LEARNING I - MEMS 4 | 1 |
| MTHM 168 | STATISTICS 1,3 | 3 |
| Hours | 16 | |
| Spring Semester | ||
| ENGL 164 or ENGL 162 | COLLEGE COMPOSITION II WITH TECHNICAL TOPICS 1,3 or COLLEGE COMPOSITION II | 3 |
| MEMS 221 | MICRO-SYSTEM CAPSTONE PROJECT 3 | 3 |
| MEMS 288 | WORK-BASED LEARNING II - MEMS 3,4 | 1 |
| Arts and Humanities Elective 6 | 3 | |
| Social Sciences Elective 7 | 3 | |
| Hours | 13 | |
| Third Year | ||
| Fall Semester | ||
| CADD 313 or TECN 422 | INTRODUCTION TO SOLIDWORKS WITH ADVANCED PROJECTS 3 or TECHNICAL PROJECT MANAGEMENT | 3-4 |
| ELCT 112 | ELECTRICAL CIRCUITS II 3 | 4 |
| MEMS 311 | PCB AND FLEX DESIGN 3 | 3 |
| PHYC 150 | GENERAL PHYSICS I 1,3 | 4 |
| TECN 115 | INDUSTRIAL BLUEPRINT READING | 2 |
| Hours | 16-17 | |
| Spring Semester | ||
| ELCT 234 | ELECTRONIC DEVICES II 3 | 4 |
| MEMS 322 | SMT MANUFACTURING 3 | 3 |
| MEMS 323 | SMT PROGRAMMING 3 | 3 |
| MEMS 387 | WORK-BASED LEARNING - MEMS 3,4 | 1 |
| QLTY 122 | BASIC QUALITY TOOLS AND APPLICATIONS 3 | 3 |
| TECN 345 | GEOMETRIC DIMENSIONING AND TOLERANCING WITH ADVANCED PROJECTS 3 | 2 |
| Hours | 16 | |
| Fourth Year | ||
| Fall Semester | ||
| HSTR 260G | HISTORY OF AMERICAN TECHNOLOGY 7 | 3 |
| HSTR 271 | AMERICAN CIVIC LITERACY 9 | 3 |
| MEMS 351 or ELCT 221 | MICROCONTROLLER HARDWARE DESIGN & PROGRAMMING 3 or MICROCONTROLLERS | 4 |
| MEMS 412 | AOI PROGRAMMING 3 | 3 |
| MEMS 413 | BGA REWORK & X-RAY INSPECTION 3 | 2 |
| MEMS 487 | WORK BASED LEARNING MEMS 3,4 | 1 |
| Hours | 16 | |
| Spring Semester | ||
| MEMS 421 | SENIOR PROJECT - NEW PRODUCT INTRODUCTION 3 | 3 |
| QLTY 241 | ISO 9001 3 | 2 |
| QLTY 334 | LEAN SIX SIGMA FOR PROCESS IMPROVEMENT WITH ADVANCED PROJECTS 3 | 4 |
| MEMS 415 | PRINCIPLES OF LABVIEW 3 | 4 |
| Arts and Humanities Electives 6 | 3 | |
| Hours | 16 | |
| Total Hours | 126-127 | |
- 1
Indicates that this course requires placement for entrance.
- 2
Required when registering for more than six credit hours or any accumulation of 12 or more credits. Exceptions to this requirement include: transfer students with GPA of 2.0 or higher, CCP students with 12 or more credit hours and a GPA of 2.0 or higher; transient students; students registering for audit only; students who have completed an associate degree or higher from an accredited institution recognized by LCCC.
- 3
Indicates that this course has a prerequisite and/or may be taken concurrently with other courses.
- 4
Student must be first employed within their field of study before taking this class - this course offers an opportunity for experiential learning in a job or internship related to the field of study of MEMS.
- 5
Indicates that this course is at a 300 level at other universities.
- 6
This program requires Arts and Humanities OT 36 electives. These courses must be chosen from two different disciplines from each other.
- 7
This program requires Social Science OT 36 electives, specifically including HSTR 260G and HSTR 271. If the student has taken HSTR 260G or HSTR 271 during the associates degree, they must take another Social Science elective as part of their bachelors degree.
- 8
Take MEMS 132 or MEMS 136 if student is more interested in manufacturing for semiconductors or in a cleanroom with a more immediate career pathway. Take MEMS 133 or ELCT 121 if student is more interested in design and a 2nd year career pathway.
- 9
This course is mandated by Ohio Senate Bill 1 signed in March 2025, no other course substitutions can be made for this class.
Program Contact(s):
Johnny Vanderford
440-366-4206
jvanderford@lorainccc.edu
For information about admissions, enrollment, transfer, graduation and other general questions, please contact your advising team.
Program Requirements
This program requires a complete application form on file by May 20 (fall cohort)
-
Eligible to apply/earn AAS MEMS
-
Cumulative GPA of 2.0 (for transfer students, it has to be combined cumulative GPA of 2.0)
More program information can be found on our website.
Credit for Prior Learning (PLA) options may be available for your program. For more information, please visit our website: www.lorainccc.edu/PLA
Program Learning Outcomes
1. Apply knowledge, techniques, skills and modern tools of mathematics, science, engineering, and technology to solve broadly-defined engineering problems appropriate to the discipline of microelectronic manufacturing (MEMS).
2. Design systems, components, or processes meeting specified needs for broadly-defined engineering problems appropriate to the discipline of microelectronic manufacturing.
3. Apply written, oral, and graphical communication in broadly-defined technical and non-technical environments; and an ability to identify and use appropriate technical literature.
4. Conduct standard tests, measurements, and experiments and to analyze and interpret the results to improve processes.
5. Function effectively as a member as well as a leader on technical teams.
Program Educational Objectives
- Achieve technical expertise in the manufacturing, assembly, and testing of microelectronic hardware by programming and operating equipment used in the field of high-volume microelectronic manufacturing.
- Apply modern manufacturing methods using industry certified processes and systematic quality tools to contribute to an organization's quality, efficiency, and cost reduction.
- Successfully implement improvements by applying product-applicable optimization techniques using product design, automated manufacturing, and Process risk analysis using Failure Mode and Effect Analysis (PFMEA).
- Apply skills in microelectronic product development, manufacturing technology, and management of a technical team developed from a collegiate internship to achieve career growth through lifelong learning, leadership, and ethical contributions.