Microelectronic Manufacturing, Bachelor of Applied Science

Curriculum Code #9601

Effective May 2024

Division of Engineering, Business and Information Technologies

The Microelectronic Manufacturing program prepares individuals to apply engineering principles and technical skills to design, assembly, prototyping, and manufacturing of printed circuit boards (PCB) used in electronic hardware production.  Includes hands-on machine operation of equipment used in high volume electronic assembly, use of software for designing PCB layout and bills of materials, programming and operation of automated PCB manufacturing equipment with surface mount technology, quality control principles including lean and six sigma, in-circuit test fixture design, test engineering, and engineering analysis of the physical design and electronic function of electronic hardware containing digital microcontrollers, analog circuitry, and MEMS sensors.  

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Indicates that this course requires a prerequisite.

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A student must register for the orientation course when enrolling for more than six credit hours per semester or any course that would result in an accumulation of 13 or more credit hours.

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Indicates that this course has a prerequisite or may be taken concurrently.

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This course offers an opportunity for experiential learning - student must be first employed within their field of study before taking this class.

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Indicates that this course is at a 300 level at other universities.

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This program requires two Arts and Humanities OT 36 electives. These courses must be chosen from two different disciplines.

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This program requires two Social Science OT 36 electives. These courses must be chosen from two different disciplines.

For information about admissions, enrollment, transfer, graduation and other general questions, please contact your advising team.

Program Requirements

This program requires a complete application form on file by May 20 (fall cohort) 

1. Eligible to apply/earn AAS MEMS

2. Cumulative GPA of 2.0 (for transfer students, it has to be combined cumulative GPA of 2.0)

More program information can be found on our website.

Program Learning Outcomes

1.  Apply knowledge, techniques, skills and modern tools of mathematics, science, engineering, and technology to solve broadly-defined engineering problems appropriate to the discipline of Printed Circuit Board (PCB) manufacturing, microelectronic manufacturing, and MicroElectroMechanical Systems (MEMS)

2.  Design systems, components, or processes meeting specified needs for broadly-defined engineering problems appropriate to the discipline of PCB manufacturing, microelectronic manufacturing, and MEMS.

3.  Apply written, oral, and graphical communication in broadly-defined technical and non-technical environments; and an ability to identify and use appropriate technical literature.

4.  Conduct standard tests, measurements, and experiments and to analyze and interpret the results to improve processes.

5.  Function effectively as a member as well as a leader on technical teams.

6a. Demonstrate the knowledge, skills, and abilities for entry into manufacturing careers, building on the strengths of associate degree, practicing various tools, techniques and processes specific to materials and manufacturing processes.

6b. Demonstrate the knowledge, skills, and abilities for entry into manufacturing careers, building on the strengths of associate degree, practicing various tools, techniques and processes specific to product design process, tooling, and assembly.

6c. Demonstrate the knowledge, skills, and abilities for entry into manufacturing careers, building on the strengths of associate degree, practicing various tools, techniques and processes specific to manufacturing systems, automation, and operations.

6d. Demonstrate the knowledge, skills, and abilities for entry into manufacturing careers, building on the strengths of associate degree, practicing various tools, techniques and processes specific to statistics, quality and continuous improvement, and industrial organization and management.

6e. Demonstrate the knowledge, skills, and abilities for entry into manufacturing careers, building on the strengths of associate degree, practicing various tools, techniques and processes specific to a capstone or integrating experience that develops and illustrates student competencies in applying both technical and non-technical skills in successfully solving manufacturing problems.

Objectives

An accreditable program will prepare graduates with technical and managerial skills necessary for entry into industry of the design, manufacturing, process optimization, inspecting, testing, and troubleshooting of PCB and related microelectronic products.  Graduates of the associate degree programs are expected to have strengths in the knowledge of equipment operations, assembly, testing, and troubleshooting of prototyping a PCB and associated microelectronic components, while baccalaureate degree graduates are expected to be prepared for careers in design, engineering process optimization, and management within the field of microelectronic manufacturing including the operation, programming, and troubleshooting of high-volume PCB manufacturing equipment, inspection, troubleshooting, repair, and technical reporting on manufactured PCB as well as quality, drafting, continuous improvement, lean manufacturing, and six sigma.

Program Educational Objectives

1. Manufacture, assemble, and test Printed Circuit Boards (PCB) by 
   programming and operating equipment used in the field of high volume PCB manufacturing.
2. Recognize manufacturing optimization methods using industry certified processes and systematic quality tools.
3. Perform on technical team using developed skills in team leadership and engineering management.
4. Successfully complete a paid internship demonstrating professional and technical responsibilities to working as a part of an engineering team in a quality manufacturing environment.